Simplified lamp design

ABSTRACT

Embodiments of the present invention generally relate to simplified, high voltage, tungsten halogen lamps for use as source of heat radiation in a rapid thermal processing (RTP) chamber or other lamp heated thermal processing chambers. Embodiments include a lamp design that includes an external fuse while reducing the number of part and expense of prior art lamps. In addition, embodiments of the lamps described herein provide sufficient rigidity to handle compressive forces of inserting the lamps into a heating assembly base, while maintaining a simplified fuse design.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/139,596, filed Sep. 24, 2018, which is a divisional of U.S. patentapplication Ser. No. 14/199,563, filed Mar. 6, 2014, which claimsbenefit of U.S. provisional patent application Ser. No. 61/787,805,filed Mar. 15, 2013, which are all herein incorporated by reference intheir entirety.

BACKGROUND OF THE INVENTION Field of the Invention

Embodiments of the present invention generally relate to an apparatusfor thermally processing a substrate. In particular, embodiments of thepresent invention relate to simplified, high voltage, tungsten halogenlamps for use as a source of heat radiation in a rapid thermalprocessing (RTP) chamber or other lamp heated thermal processingchambers.

Description of the Related Art

During RTP of substrates, thermal radiation is generally used to rapidlyheat a substrate in a controlled environment to a maximum temperature ofup to about 1350° C. This maximum temperature is maintained for aspecific amount of time ranging from less than one second to severalminutes depending on the particular process. The substrate is thencooled to room temperature for further processing.

High voltage, e.g., about 40 volts to about 130 volts, tungsten halogenlamps are commonly used as the source of heat radiation in RTP chambers.High voltage tungsten halogen lamps require a fuse in the circuit toprevent arcing and potential explosion in the lamp during lamp failure.Providing the fuse internal to the capsule of the lamp is difficult toimplement due to small capsule size and potential contaminationaffecting the halogen cycle. Providing the fuse in the press seal of thelamp may result in undesirable cracking or breaking of the press seal.Thus, it is desirable to incorporate the fuse external to the capsuleand press seal. Current lamp designs include a number of additionalcomponents (e.g., stainless steel tube, ceramic potting compound, plugs)in order to provide a fuse external to the capsule and press seal whileproviding sufficient rigidity to the leads for mating to a heatingassembly base of an RTP chamber.

Therefore, it is desirable to provide a simplified, high voltage,tungsten halogen lamp design to reduce cost and provide arc protectionduring lamp failure.

SUMMARY OF THE INVENTION

In one embodiment of the present invention, a lamp assembly comprises acapsule having a filament disposed therein, a press seal extending fromthe capsule and configured to hermetically seal the capsule, a firstlead and a second lead, a third lead extending from the press seal, anda fuse electrically coupling the third lead to one of the first andsecond leads external to the press seal and capsule. Each of the firstand second leads is electrically coupled to the filament within thepress seal and extends from the press seal. The third lead iselectrically isolated from the first and second leads within the pressseal.

In another embodiment, a lamp assembly comprises a capsule having afilament disposed therein, a press seal extending from the capsule andconfigured to hermetically seal the capsule, a first lead and a secondlead, an insulative sleeve coupled to the first lead external to thepress seal, a third lead coupled to the insulative sleeve, and a fuseelectrically coupling the first lead to the third lead. Each of thefirst and second leads is electrically coupled to the filament withinthe press seal and extends from the press seal.

In yet another embodiment, a lamp assembly comprises a capsule having afilament disposed therein, a press seal extending from the capsule andconfigured to hermetically seal the capsule, a first lead and a secondlead, an insulative sleeve coupled to the press seal, a third leadcoupled to the insulative sleeve, and a fuse electrically coupling thefirst lead to the third lead. Each of the first and second leads iselectrically coupled to the filament within the press seal and extendsfrom the press seal. At least the first lead extends into the insulativesleeve.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above recited features of the presentinvention can be understood in detail, a more particular description ofthe invention, briefly summarized above, may be had by reference toembodiments, some of which are illustrated in the appended drawings. Itis to be noted, however, that the appended drawings illustrate onlytypical embodiments of this invention and are therefore not to beconsidered limiting of its scope, for the invention may admit to otherequally effective embodiments.

FIG. 1 is a schematic, cross-sectional view of an RTP chamber in whichembodiments of the present invention are used.

FIG. 2 (prior art) is a schematic, cross-sectional view of a prior arttungsten halogen lamp assembly for use in an RTP chamber, such as theRTP chamber of FIG. 1.

FIGS. 3A-3F are schematic depictions of high voltage, tungsten halogenlamp assembly designs according to embodiments of the present inventionfor use in an RTP chamber, such as the RTP chamber of FIG. 1.

FIGS. 4A-4F are schematic depictions of high voltage, tungsten halogenlamp assembly designs according to embodiments of the present inventionfor use in an RTP chamber, such as the RTP chamber in FIG. 1.

FIGS. 5A-5D are schematic depictions of high voltage, tungsten halogenlamp assembly designs according to embodiments of the present inventionfor use in an RTP chamber, such as the RTP chamber in FIG. 1.

FIG. 6A is a top, cross-sectional view, and FIG. 6B is a side,cross-sectional view of a high voltage, tungsten halogen lamp assemblydesign according to another embodiment of the present invention for usein an RTP chamber, such as the RTP chamber in FIG. 1.

FIG. 6C is a detail view “C” of the engagement between the sleeve andthe press seal of FIG. 6A according to another embodiment.

FIG. 6D is a top, cross-sectional view of another embodiment of a highvoltage, tungsten halogen lamp assembly design for use in an RTPchamber, such as the RTP chamber in FIG. 1.

DETAILED DESCRIPTION

Embodiments of the present invention generally relate to simplified,high voltage, tungsten halogen lamps for use as source of heat radiationin a rapid thermal processing (RTP) chamber or other lamp heated thermalprocessing chambers. Embodiments include a lamp assembly design thatincludes an external fuse while reducing the number of part and expenseof prior art lamps. In addition, embodiments of the lamps describedherein provide sufficient rigidity to handle compressive forces ofinserting the lamps into a heating assembly base, while maintaining asimplified fuse design.

FIG. 1 is a schematic, cross-sectional view of an RTP chamber 100 inwhich embodiments of the present invention are used. The RTP chamber 100includes sidewalls 102, a chamber bottom 104 coupled to the sidewalls102, and a quartz window 106 disposed over the sidewalls 102. Thesidewalls 102, the chamber bottom 104, and the quartz window 106 definean inner volume 108 for processing a substrate 110 therein.

A slit valve door 116 may be formed through the sidewalls 102 fortransferring a substrate therethrough. The RTP chamber 100 is coupled toa gas source 118 configured to provide one or more processing gases tothe inner volume 108 during processing. A vacuum pump 120 may be coupledto the RTP chamber 100 for pumping out the inner volume 108.

A substrate positioning assembly 122 is disposed in the inner volume 108and configured to support, position, and/or rotate the substrate 110during processing. Particularly, the substrate positioning assembly 122may be a non-contact substrate supporting device using flows of fluid tosupport, position, and/or rotate the substrate 110.

A heating assembly 112 is disposed above the quartz window 106 andconfigured to direct thermal energy towards the inner volume 108 throughthe quartz window 106. The heating assembly 112 includes a plurality oflamps 114, such as high voltage tungsten halogen lamps disposed in ahexagonal pattern and controllable in zones to provide controlledheating to different zones of the inner volume 108. Each of theplurality of lamps 114 is inserted into a heating assembly base 117 forelectrical connection to a power supply (not shown).

FIG. 2 (prior art) is a schematic, cross-sectional view of a prior arttungsten halogen lamp assembly 200 for use in an RTP chamber such as theRTP chamber 100. The lamp assembly 200 includes a quartz capsule 202housing a tungsten filament 204. Tungsten leads 206 extend from thefilament 204 and are each attached (e.g., welded) to molybdenum foil208. Molybdenum leads 210 are attached to (e.g., welded) and extend fromthe molybdenum foil 208. A quartz press seal 212 encapsulates andcreates a hermetic seal about the molybdenum foil 208. The molybdenumleads 210 extend out of the press seal 212 for electrical connection.

The press seal 212 and molybdenum leads 210 are inserted into astainless steel cylinder 214, where the molybdenum leads 210 areconnected (e.g., welded) to a conductive pin assembly 216 extendingthrough the cylinder 214. A fuse 218 is serially attached between atleast one of the molybdenum leads 210 and the conductive pin assembly216. The cylinder 214 is then filled with a ceramic potting compound215, and the end of the cylinder 214 is sealed with a plastic plug 220.The plastic plug 220 has conductive pins 222 extending therethrough andelectrically connected to the conductive pin assembly 216. Theconductive pins 222 are inserted into a heating assembly base, such asthe base 117 from FIG. 1, for connection to a power supply.

The lamp assembly 200 includes features having a number of drawbacks.For example, the lamp assembly 200 has a number of expensive parts, suchas the stainless steel cylinder 214 and the plastic plug 220, of whichit would be beneficial to eliminate. In addition, the ceramic pottingcompound provides rigidity to allow the fuse 218 connection to withstandcompressive forces of inserting the lamp assembly 200 into a heatingassembly base. However, the potting compound is a porous material thatcan potentially introduce organic contamination into the RTP chamber.Thus, a simplified lamp assembly design eliminating a number of theparts of prior art lamp designs is desirable.

FIGS. 3A-3F are schematic depictions of high voltage, tungsten halogenlamp assembly designs according to embodiments of the present inventionfor use in an RTP chamber, such as the RTP chamber 100 or other lampheated thermal processing chambers. The lamp assembly 300 depicted ineach of these Figures includes a quartz capsule 302 housing a tungstenfilament 304. Tungsten leads 306 a, 306 b extend from the filament 304and are each attached (e.g., welded) to molybdenum foil 308 a, 308 b.Molybdenum leads 310 a, 310 b are attached to (e.g., welded) and extendfrom the molybdenum foil 308 a, 308 b. A quartz press seal 312encapsulates and creates a hermetic seal about the molybdenum foil 308a, 308 b. The molybdenum leads 310 a, 310 b extend out of the press seal312.

Each of the lamp assemblies 300 in FIGS. 3A-3B also includes a thirdlead 311 extending from the press seal 312. Each of the leads 311includes a hook portion 313 on the end that is encapsulated within thepress seal 312 to provide better attachment and stability of the lead311. In one embodiment, the hook portion 313 is a right angle bend inthe lead 311. Each of the third leads 311 is electrically isolated fromthe leads 310 a, 310 b within the press seal 312 via the quartz materialmaking up the press seal 312. In addition, each of the lamp assemblies300 includes a fuse 318 electrically connected between one of the leads310 a, 310 b and the lead 311. The fuse 318 composition is from the samefamily of metals used for lamp fuses, e.g., nickel, zinc, copper,silver, aluminum, and alloys thereof. Although shown as a wire orribbon, the fuse 318 may include an insulating encasement.

In the embodiment depicted in FIG. 3A, the lead 310 a includes a bend315 within the press seal 312 and a straight portion 317 that extendsfrom the bend 315 through the press seal 312 substantially parallel tothe lead 310 b. The third lead 311 is slightly offset from the lead 310a and extends from the press seal 312 substantially parallel to the lead310 b. The fuse 318 laterally extends between the lead 311 and the lead310 a, such that the fuse 318 is substantially perpendicular to the lead311 and the lead 310 a.

In the embodiment depicted in FIG. 3B, each of the leads 310 a, 310 bextend from the press seal 312 substantially parallel to one another.The third lead 311 is embedded in the press seal 312 between the leads310 and has a first straight portion 319 extending from the press seal312 substantially parallel to the leads 310 a, 310 b. The lead 311includes a bend portion 321 extending from the first straight portion319 external to the press seal 312. The lead 311 includes a secondstraight portion 323 extending from the bend portion 321 andsubstantially parallel to the lead 310 b. The fuse 318 extends betweenthe lead 310 a and the bend portion 321 of the lead 311.

In the embodiment depicted in FIG. 3C, each of the leads 310 a, 310 bextend from the press seal 312 substantially parallel to one another.The third lead 311 is embedded in the press seal 312 between the leads310 and has a first straight portion 319 extending from the press seal312 substantially parallel to the leads 310 a, 310 b. The lead 311includes a bend portion 321 extending from the first straight portion319 external to the press seal 312. The lead 311 includes a secondstraight portion 323 extending from the bend portion 321 andsubstantially parallel to the lead 310 b. The second straight portion323 of the lead 311 is substantially in-line with the lead 310 a. Thefuse 318 extends between the lead 310 a and the second straight portion323 of the lead 311, such that the lead 310 a, the fuse 318, and thesecond straight portion 323 of the lead 311 are substantially in-line.

Therefore, each of the lamp assemblies 300 depicted in FIGS. 3A-3C,provides for connection between the leads 311, 310 b directly into aheating assembly base, such as the heating assembly base 117 whileeliminating a number of parts (e.g., stainless steel cylinder, plug,ceramic potting compound) from prior art high voltage, tungsten halogenlamps. In addition, the additional third lead 311 provides the rigidityto absorb the compressive forces applied during insertion of the lamp300 into the heating base 117 (i.e., prevents the fuse 318 fromundergoing compression).

Although FIGS. 3A-3C depict only the lead 310 a connected to the fuse318, either lead 310 a or 310 b could be connected to the fuse 318. Inanother embodiment shown in FIGS. 3D-3F, two leads 311 are provided andeach of the leads 310 a and 310 b are electrically coupled to a fuse 318in substantially the same configurations shown in FIGS. 3A-3C, i.e.,both the lead 310 b is connected to an additional lead 311 in the samemanner as lead 310 a is shown connected to the lead 311. Additionally,each of the leads 310 b and 311 may be configured to be compatible withexternal delivery sockets, e.g., mating sockets in a printed circuitboard.

FIGS. 4A-4F are schematic depictions of high voltage, tungsten halogenlamp assembly designs according to embodiments of the present inventionfor use in an RTP chamber, such as the RTP chamber 100 or other lampheated thermal processing chambers. The lamp assembly 400 depicted ineach of these Figures includes a quartz capsule 402 housing a tungstenfilament 404. Tungsten leads 406 a, 406 b extend from the filament 404and are each attached (e.g., welded) to molybdenum foil 408 a, 408 b.Molybdenum leads 410 a, 410 b are attached to (e.g., welded) and extendfrom the molybdenum foil 408 a, 408 b. A quartz press seal 412encapsulates and creates a hermetic seal about the molybdenum foil 408a, 408 b. The molybdenum leads 410 a, 410 b extend out of the press seal412.

In each of the FIGS. 4A-4C, a conductive pin 414 is attached (e.g.,welded) to the lead 410 b. In addition, an insulative sleeve 416 (e.g.,ceramic or plastic sleeve), a fuse 418, and a conductive pin 420 areattached to the lead 410 a. The fuse 418 composition is from the samefamily of metals used for lamp fuses, e.g., nickel, zinc, copper,silver, aluminum, and alloys thereof. The conductive pin 414, theinsulative sleeve 416, the fuse 418, and the conductive pin 420 providea rigid, conductive extension for inserting the lamp assembly 400 intothe heating base 116.

In the embodiment shown in FIG. 4A, the insulative sleeve 416 has a thinmetallic layer 422 deposited over the inner surface 417 of the sleeve416. The equivalent cross-section of the metallic layer 422 (normal tothe current flow) approximately corresponds to that of a fuse wire orribbon designed for this application. Likewise the metallic layer 422composition is from the same family of metals used for lamp fuses, e.g.,nickel, zinc, copper, silver, aluminum, and alloys thereof. The lead 410a and the conductive pin 420 are electrically connected to the metalliclayer 422, e.g., soldered or brazed. The thin metallic layer 422 isconstructed to act as the fuse 418.

In the embodiment shown in FIG. 4B, the insulative sleeve 416 has a thinmetallic trace 424 deposited along one side of the inner surface 417 ofthe sleeve 416. The lead 410 a and the conductive pin 420 are fixed tothe sleeve 416 in electrical contact with the trace 424, which acts asthe fuse 418. The lead 410 a and the conductive pin 420 may be attachedto the sleeve 416 using a ceramic compound, a high temperature epoxy, ahigh temperature phenolic resin, or shrink tubing, for example. Thetrace 424 can be extended to cover the entire inner diameter for a shortaxial extent at the top and bottom of the insulative sleeve 416 topermit attachment of the sleeve 416 to the conductive pin 420 and thelead 410 a by soldering or brazing.

In the embodiment shown in FIG. 4C, a wire fuse 418 is attached (e.g.,welded, soldered) to the lead 410 a and extends through the insulativesleeve 416. The fuse 418 is further attached (e.g., welded, soldered) tothe conductive pin 420. The lead 410 a and the conductive pin 420 may beattached to the sleeve 416 using a ceramic compound, a high temperatureepoxy, a high temperature phenolic resin, or shrink tubing, for example.For any of the designs shown in FIGS. 4A, 4B, and 4C, the insulativesleeve 416 may be filled with low melting point glass beads orinsulating particles to act as an arc quenching ballotini type fuse.

Therefore, each of the lamp assemblies 400 depicted in FIGS. 4A-4C,provides for connection between the leads 410 a, 410 b and theconductive pins 414, 420 into a heating assembly base, such as theheating assembly base 117 while eliminating a number of parts (e.g.,stainless steel cylinder, plug, ceramic potting compound) from prior arthigh voltage, tungsten halogen lamps. In addition, the insulative tubeconfiguration provides the rigidity to absorb the compressive forcesapplied during insertion of the lamp assembly 400 into the heating base117.

Although each of the FIGS. 4A-4C depict a conductive pin 414 attached tothe lead 410 b, in an additional embodiment shown in FIGS. 4D-4F, thelead 410 b is attached to an additional insulative sleeve 416 (e.g.,ceramic or plastic sleeve), an additional fuse 418, and an additionalconductive pin 420 in the same manner as shown with regard to lead 410a. Additionally, each of the pins 414 and 420 may be configured to becompatible with external delivery sockets, e.g., mating sockets in aprinted circuit board.

FIGS. 5A-5D are schematic depictions of high voltage, tungsten halogenlamp assembly designs according to embodiments of the present inventionfor use in an RTP chamber, such as the RTP chamber 100 or other lampheated thermal processing chambers. The lamp assembly 500 depicted ineach of these Figures includes a quartz capsule 502 housing a tungstenfilament 504. Tungsten leads 506 a, 506 b extend from the filament 504and are each attached (e.g., welded) to molybdenum foil 508 a, 508 b.Molybdenum leads 510 a, 510 b are attached to (e.g., welded) and extendfrom the molybdenum foil 508 a, 508 b. A quartz press seal 512encapsulates and creates a hermetic seal about the molybdenum foil 508a, 508 b. The molybdenum leads 510 a, 510 b extend out of the press seal512.

In each of the FIGS. 5A-5B, a conductive pin 514 is attached (e.g.,welded) to the lead 510 b. In addition, an insulative sleeve 516 (e.g.,ceramic or plastic sleeve), a fuse 518, and a conductive cap 520 areattached to the lead 510 a. The fuse 518 composition is from the samefamily of metals used for lamp fuses, e.g., nickel, zinc, copper,silver, aluminum, and alloys thereof. The conductive pin 514, theinsulative sleeve 516, the fuse 518, and the conductive cap 520 providea rigid, conductive extension for inserting the lamp assembly 500 intothe heating base 116.

In the embodiment shown in FIG. 5A, the end of the lead 510 a has anexternally threaded portion 511. The insulative sleeve 516 has amatching internally threaded portion 517, which mates to the externallythreaded portion 511 of the lead 510 a. The wire fuse 518 iselectrically attached (e.g., welded, soldered) to the lead 510 a. Thefuse 518 is also electrically connected (e.g., welded, soldered) to theconductive cap 520. The cap 520 may be crimped onto the outer surface522 of the insulative sleeve 516 and engage a groove 524 formed in theouter surface 522 of the sleeve 516 to secure the connection.

In the embodiment shown in FIG. 5B, the end of the lead 510 a has ahollow portion 513 that is electrically connected (e.g., welded,soldered) to the fuse 518. The end of the insulative sleeve 516 has afirst flange portion 515. The first flange portion 515 of the sleeve 516is inserted into the hollow portion 513 of the lead 510 a, and the walls509 of the lead 510 a are crimped over the first flange portion 515 ofthe sleeve 516 to secure the connection. The fuse 518 extends throughthe sleeve 516, and is electrically connected (e.g., welded, soldered)to the cap 520. The cap 520 may be crimped over a second flange portion525 of the sleeve 516 to secure the connection.

Therefore, each of the lamp assemblies 500 depicted in FIGS. 5A-5B,provides for connection between the leads 510 a, 510 b and theconductive pin 514 and cap 520 into a heating assembly base, such as theheating assembly base 116 while eliminating a number of parts (e.g.,stainless steel cylinder, plug, ceramic potting compound) from prior arthigh voltage, tungsten halogen lamps. In addition, the insulative tubeconfiguration provides the rigidity to absorb the compressive forcesapplied during insertion of the lamp assembly 500 into the heating base116.

Although in each of the FIGS. 5A-5B, a conductive pin 514 is attached tothe lead 510 b, in an additional embodiment shown in FIGS. 5D-5E, thelead 510 b is attached to an additional insulative sleeve 516, anadditional fuse 518, and an additional conductive cap 520 in the samemanner as shown with respect to the lead 510 a. Additionally, each ofthe pin 514 and the conductive cap 520 may be configured to becompatible with external delivery sockets, e.g., mating sockets in aprinted circuit board.

FIG. 6A is a top, cross-sectional view, and FIG. 6B is a side,cross-sectional view of a high voltage, tungsten halogen lamp assemblydesign according to another embodiment of the present invention for usein an RTP chamber, such as the RTP chamber 100 or other lamp heatedthermal processing chambers. The lamp assembly 600 includes a quartzcapsule 602 housing a tungsten filament 604. Tungsten leads 606 a, 606 bextend from the filament 604 and are each attached (e.g., welded) tomolybdenum foil 608 a, 608 b. Molybdenum leads 610 a, 610 b are attachedto (e.g., welded) and extend from the molybdenum foil 608 a, 608 b. Aquartz press seal 612 encapsulates and creates a hermetic seal about themolybdenum foil 608 a, 608 b. The molybdenum leads 610 a, 610 b extendout of the press seal 612.

A conductive pin 614 is attached (e.g., welded) to the lead 610 b. Afuse 618 is electrically attached (e.g., welded) to the lead 610 a. Thefuse 618 composition is from the same family of metals used for lampfuses, e.g., nickel, zinc, copper, silver, aluminum, and alloys thereof.A sleeve 616 is attached to the press seal 612 and has the pin 614 andthe fuse 618 extending therethrough. The sleeve 616 may be formed from aplastic material, such as a high temperature plastic. In one embodiment,the press seal 612 has a groove 613 formed in its outer surface 615. Amating extension 617 is formed in the sleeve 616, such that whenengaged, the extension 617 snaps into the groove 613, and locks theminto place. A conductive pin 620 is press fit into the opposite end ofthe sleeve 616. The conductive pin 620 has a groove 621 formed thereinto match a mating extension 619 formed in the sleeve 616, such that whenengaged the extension 619 snaps into the groove 621, and locks them intoplace. The fuse 618 extends through a hole in the conductive pin 620.The fuse 618 is electrically attached (e.g., welded) to the conductivepin 620.

FIG. 6C is a detail view “C” of the engagement between the sleeve 616and the press seal 612 according to another embodiment. In thisembodiment, the sleeve 616 may be formed from a ceramic material. Thesleeve 616 has a groove 627 formed therein to approximately match thegroove 613 in the press seal 612. The mating grooves (627, 613) arefilled with a sealant material 629, such as ceramic potting material,solder, metal wire, or adhesive, to lock the sleeve 616 and press seal612 into place. A hole (not shown) may be formed in the sleeve 616 forinsertion of the sealant material 629.

Therefore, the lamp assembly 600 depicted in FIGS. 6A-6C, provides forconnection between the leads 610 a, 610 b and the conductive pins 614,620 into a heating assembly base, such as the heating assembly base 117while eliminating a number of parts (e.g., stainless steel cylinder,plug, ceramic potting compound) from prior art high voltage, tungstenhalogen lamps. In addition, the plastic sleeve configuration providesthe rigidity to absorb the compressive forces applied during insertionof the lamp assembly 600 into the heating base 117.

Although in each of the FIGS. 6A-6B, a conductive pin 614 is attached tothe lead 610 b, in an additional embodiment shown in FIG. 6D, the lead610 b is attached to an additional fuse 618 and pin 620 in the samemanner as shown with respect to the lead 610 a. Additionally, each ofthe pins 614 and 620 may be configured to be compatible with externaldelivery sockets, e.g., mating sockets in a printed circuit board.

While the foregoing is directed to embodiments of the present invention,other and further embodiments of the invention may be devised withoutdeparting from the basic scope thereof, and the scope thereof isdetermined by the claims that follow.

The invention claimed is:
 1. A lamp assembly, comprising: a capsulehaving a filament disposed therein; a press seal extending from thecapsule and configured to hermetically seal the capsule; a first leadand a second lead, wherein each of the first and second leads iselectrically coupled to the filament, a first end of each of the firstand second leads disposed within the press seal; an insulative sleevedirectly coupled to a second end of the first lead and spaced a distancefrom the press seal, the insulative sleeve comprising plastic materialor filled with glass beads; a conductive cap or pin coupled to theinsulative sleeve; and a fuse electrically coupling the first lead tothe conductive cap or pin.
 2. The lamp assembly of claim 1, wherein thefuse comprises a metallic coating on an inner surface of the insulativesleeve.
 3. The lamp assembly of claim 1, wherein the fuse comprises ametallic trace on an inner surface of the insulative sleeve.
 4. The lampassembly of claim 1, wherein the fuse comprises a wire extending throughthe insulative sleeve.
 5. The lamp assembly of claim 1, wherein thefirst lead and the conductive pin are attached to the insulative sleeveby a ceramic material.
 6. The lamp assembly of claim 1, wherein theinsulative sleeve is filled with insulating particles.
 7. The lampassembly of claim 1, wherein the second lead is coupled to a secondconductive pin.
 8. A lamp assembly, comprising: a capsule having afilament disposed therein; a press seal extending from the capsule andconfigured to hermetically seal the capsule; a first lead and a secondlead, wherein each of the first and second leads is electrically coupledto the filament, a first end of each of the first and second leadsdisposed within the press seal; a first insulative sleeve directlycoupled to a second end of the first lead and spaced a distance from thepress seal; a first conductive cap or pin coupled to the firstinsulative sleeve; a first fuse electrically coupling the first lead tothe first conductive cap or pin; a second insulative sleeve coupled to asecond end of the second lead and spaced apart from the press seal; asecond conductive pin coupled to the second insulative sleeve; and asecond fuse electrically coupling the second lead to the secondconductive pin.
 9. The lamp assembly of claim 8, wherein the first leadand the second lead are substantially parallel.
 10. The lamp assembly ofclaim 8, wherein the first insulative sleeve and the first lead arecoupled via a threaded connection.